Simulation and Analysis of Welding Spot Failure of PCB Based on ABAQUS

Abstract

Abstract In the manufacturing process, the welding spot of PCB may lose efficacy because of the strain and stress impact. The reason for the occurrence of high-stress zones is the effect of the load brought by the manufacturing and assembly process. It is a giant challenge for the industry community to solve the problem of welding spots losing efficacy. In this paper, the manufacturing techniques and assembly process will be analyzed first. With the analysis result, the main impact of load would be checked. Then, with the confirmed allowable stress by calculation, the value of input stress, which may cause the welding spot to lose efficacy, would be obtained. Finally, the result of this study would be confirmed by the simulation result generated by the finite element analysis software.