Author:
Ronshin Fedor,Dementyev Yuriy,Chinnov Evgeny
Abstract
Abstract
Existing cooling systems do not fulfil modern requirements for heat removal from high-heat dissipating sources in electronic and microelectronic equipment. When reducing the flat channel thickness, the ratio of the surface to the volume increases inversely to the minimal transverse size of the channel, resulting in high intensity of heat transfer in microsystems. Schlieren and infrared methods serve to determine the main characteristics of a two-phase flow. The characteristics of heat and mass transfer and regimes are studied at various values of the heat flux.
Subject
General Physics and Astronomy