Physical and mechanical properties and structure of copper-based composite materials for diamond tools binder

Abstract

Abstract The article describes the structure and physical and mechanical properties of dispersion-strengthened composite materials of Cu-Al-Ti-Sn-C-O system developed as a binder for making diamond tools for grinding composite materials and, in particular, hard alloys. It is shown that the materials under analysis have high thermal conductivity and recrystallization temperature values and are not inferior by mechanical properties to Cu-Sn system binders and, in particular, Cu-20 Sn binder widely used in the industry.