Author:
Li Liyuan,Li Jinhui,Lv Xialei,Niu Fangfang,Sun Rong
Abstract
Abstract
Bisphenol A and its congeneric compounds are key materials in photosensitive solder mask inks to improve the toughness property. However, the cured epoxy resins often exhibit brittleness and restrict their usability in solder mask inks. A series of reinforced and toughened curing epoxy resins were prepared by incorporating core-shell rubber (CSR) and nano SiO2 into diglycidyl ether of bisphenol A (DGEBA). A comprehensive investigation was executed to analyze the influence of different contents of CSR and CSR/SiO2 on the curing process, network characteristics, and mechanical properties of epoxy resins. The experimental data deliver that the introduction of CSR/SiO2 in appropriate proportions could boost the toughness and strength of cured epoxy resin significantly, while thermal stability is also improved. Nano SiO2, with its high surface area and unique surface properties, can act as a reinforcing filler, enhancing the mechanical properties of the epoxy resin, while CSR provides both strength and toughness to the composite. The fracture surface of CSR/SiO2-modified epoxy resin also demonstrates that the CSR and SiO2 nanoparticles in the epoxy matrix could effectively block the development of cracks and produce plastic deformation around the material when the material is subjected to external forces. Therefore, the prepared high-performance CSR/SiO2-based DGEBA showed great potential in solder mask inks.