Transient oscillatory processes at the balancing device operation of abrasive wheel grinder

Author:

Kashirskaya E N,Kholopov V A,Antonov S V,Pimenov A V

Abstract

Abstract In conditions of the practice development of building new production facilities following the concept of Industry 4.0 and the intensification and complication of production processes, the need for a general reduction in costs arises. One of these problems is the lengthening the life of supports of abrasive wheel grinding machines based on the balancing process automation without stopping the machines for maintenance work. This paper proposes a method for numerical calculation of the motion path of the grinding wheel spindle axis during the balancing process. Based on the proposed method, a numerical calculation was carried out and the motion path of the grinding wheel centre was built. As a result of the work, a transient balancing oscillatory process of a damping mode was built. This process does not lead to the forcing of the system in the eigenmode range, which creates prospects for the introduction of this balancing method in the grinding process and reducing production costs.

Publisher

IOP Publishing

Subject

General Physics and Astronomy

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. The Waviness Control Algorithm Surface Grinding;Lecture Notes in Mechanical Engineering;2022

2. The Dynamic Model of Unbalanced Grinding Wheel;Lecture Notes in Mechanical Engineering;2022

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