Utilization of alternative wood particles for modern thermal insulation products

Author:

Zach J,Peterková J,Novák V,Korjenic A

Abstract

Abstract Thermal insulation materials play a vital role in minimising energy loss in building operation and also affect the amount of greenhouse gas emissions associated with heating and cooling. In this context, it is becoming an increasingly important milestone to find suitable thermal insulation materials that not only meet the technical requirements but also minimise their environmental impact. The trend towards the use of eco-friendly materials for thermal insulation reflects the construction industry’s desire to contribute to environmental protection and the transition to more sustainable models of building construction and renovation. For more than 20 years, a number of research teams have been investigating the possibility of replacing synthetically produced materials such as mineral wool and polystyrene foam with natural fibre-based insulation materials. These alternatives include wood as a traditional, easily renewable raw material. This, together with the low energy intensity of processing and manufacturing wood materials, contributes to its low carbon footprint. Compared to traditional synthetic insulation materials, which are often energy intensive to produce, wood is a more environmentally friendly choice. However, with many European countries now facing a potential shortage of higher quality wood, it is necessary to look for alternative sources of wood, including in the field of thermal insulation materials, materials with a lower carbon footprint that can be produced from lower quality wood or from wood waste that would otherwise only have an energy use. The paper is devoted to the study and use of suitable wood waste and secondary raw materials from spruce wood (coarse wood chips, sawdust and wood flour) for the development of modern thermal insulations with the aim of an environmentally friendly and less energy-intensive production process compared to conventional insulants.

Publisher

IOP Publishing

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