Mutual mass transfer between the target and the substrate in the process of ion sputtering. Flat and cylindrical target

Abstract

Abstract The ion sputtering process for the deposition of coatings from alternating layers of light and heavy metals are considered, taking into account the mutual mass transfer from the target to the substrate and from the substrate to the target as the result of resputtering the coating matter by reflected fast neutral gas atoms (former primary bombarding ions, backscattered from the target towards the substrate). The resputtering effect is more important in the case of deposition of a heavy metal of Ta type on layer from a light matter of Si type since it forms the intermediate layer of mixing composition “Ta + Si” between layers of pure metals.