An investigation of the tensile deformation and failure of an epoxy/Cu interface using coarse-grained molecular dynamics simulations
Author:
Funder
National Science Foundation
Publisher
IOP Publishing
Subject
Computer Science Applications,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modeling and Simulation
Link
http://stacks.iop.org/0965-0393/22/i=6/a=065011/pdf
Reference42 articles.
1. Analyses of the practical adhesion strengths of the metal/polymer interfaces in electronic packaging
2. Effect of the microstructure of copper oxide on the adhesion behavior of epoxy/copper leadframe joints
3. Adhesion and Fracture of Interfaces Between Immiscible Polymers: from the Molecular to the Continuum Scal
4. Characterization of the intrinsic strength between epoxy and silica using a multiscale approach
5. Establishment of the coarse grained parameters for epoxy-copper interfacial separation
Cited by 16 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Coupling of an atomistic model and bond-based peridynamic model using an extended Arlequin framework;Computer Methods in Applied Mechanics and Engineering;2023-01
2. Direct visualization of cooperative adsorption of a string-like molecule onto a solid;Science Advances;2022-10-14
3. Multiscale Methods for Lightweight Structure and Material Characterization;Advanced Multifunctional Lightweight Aerostructures; Design, Development, and Implementation;2021-02-12
4. Atomistic investigation of functionalized polyethylene-alumina interfacial strength and tensile behaviour;Computational Materials Science;2021-02
5. Hierarchical Multiscale Approach for Modeling the Deformation and Failure of Epoxy-Based Polymer Matrix Composites;The Journal of Physical Chemistry B;2020-12-17
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3