Enhancing the efficiency of non toxic perovskite solar cell through Cs4CuSb2Cl12 as interface layer using SCAPS-1D

Author:

Khan Abdul Haseeb HassanORCID,Khan Aqib AliORCID,Farid Amjad

Abstract

Abstract In recent years, Perovskite solar cells (PSC) have showed promising results to substitute traditional PV technologies due to impressive power conversion efficiency (PCE) and cost-effective production. This study investigates the impact of introducing a Cs4CuSb2Cl12 (CCSC) perovskite quantum dot (PQD) interface layer among active layer and hole transport layer (HTL) in CsGeI3 as well as MAGeI3-based PSCs. It aims in enhancing the function of interface layer (IL) by improving PCE while reducing interface losses. TiO2 and Spiro-OMeTAD were employed as the electron transport layer (ETL) and HTL, respectively. SCAPS-1D software was utilized for simulating JSC, VOC, FF, and PCE of various configurations, including passivated and non-passivated structures. The results revealed a substantial increase in JSC from 13.22 mA cm−2 to 15.5 mA cm−2 and PCE from 11.67% to 14.81% for MAGeI3-based PSCs with incorporated PQD layer. Additionally, the fill factor (FF) improved from 50.55% to 76.90%. However, a decrease in VOC from 1.7 V towards 1.24 V was noticed, this was associated with the formation of an energy barrier at HTL/ absorber. For CsGeI3-based devices, a slight improvement in JSC was observed from 21.0 mA cm−2 to 21.8 mA cm−2, whereas VOC remained constant at 1.24 V. The PCE increased from 22.50% to 23.09%, but the FF decreased from 86.83% to 85.48%. However the decrease in the fill factor (FF) may be attributable to a rise in the cell series resistance due to the additional interface, which could impede charge transport and extraction. This simulation study demonstrates that the incorporation of a CCSC PQD IL among active layer / HTL can enhance the PCE and short circuit current of CsGeI3 and MAGeI3-based PSCs, providing a promising avenue for future optimizations and advancements in PSC technologies.

Publisher

IOP Publishing

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