Study on electrochemical polishing mechanism of TC4 titanium alloy

Author:

Wang Youliang,Liu Haiwang,Yin XinchengORCID,Zhou Yuhang,Feng Ming,Li Sisi

Abstract

Abstract To achieve a high-quality and precise surface on TC4 titanium alloy for demanding engineering applications, electrochemical polishing (ECP) technology was employed to investigate the polishing process of TC4 titanium alloy in an ethylene glycol-sodium chloride green electrolyte. The macro and micro morphology, surface roughness, material removal rate, surface elements, surface corrosion resistance, and surface hardness of TC4 titanium alloy were measured before and after polishing. Single-factor experiments were conducted to explore the effects of processing gap, electrolyte temperature, polishing voltage, and polishing time on TC4 titanium alloy surface quality. Optimal polishing parameters were determined to be an electrode gap of 12 mm, a voltage of 20 V, a temperature of 40 °C, and a polishing time of 10 min. The experimental results indicated that after electrochemical polishing, the workpiece surface roughness Ra decreased from 256 nm to 25 nm, achieving a roughness reduction rate of 90.23%, the material removal rate was 3.348 μm min−1. The self-corrosion potential of the polished surface increased from −0.416 V to −0.375 V and the self-corrosion current density decreased from 4.447 × 10−7 A·cm−2 to 1.873 × 10−7 A·cm−2, the surface indentation hardness of the workpiece decreased from 5.8669 GPa to 4.6726 GPa. Based on the characterization of polished surface, the mechanism of electrochemical polishing of TC4 titanium alloy was proposed. The results demonstrate that electrochemical polishing of TC4 titanium alloy is highly efficient, involves no mechanical action, and causes no subsurface damage, making it a promising technology to meet medical requirements.

Funder

Wenzhou Major Science and Technology Innovation Project

National Natural Science Foundation of China

Lanzhou Youth Talent Project

Natural Science Foundation of Gansu Province

Publisher

IOP Publishing

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3