Finite element analysis based verification of shape estimation performance according to displacement conditions and module types of FBG bending sensor

Author:

Kim Jiwon,Lee Hyun-Woo,Kim Dae-HyunORCID

Abstract

Abstract This study proposes a novel, versatile sensor application solution suitable for various environments by verifying the shape estimation performance of three different module types of an FBG bending sensor based on finite element analysis. FBG bending sensors, including the individual attachment type, triangular stacking type, and band type, were attached to the structure. Subsequently, two simple plane displacement and one complex 3D displacement were applied to the structure to derive the strain for nine cases through finite element analysis. The shape estimation performance was then verified through a simulation based on the previously derived strain. As a result of verifying the shape estimation performance, it was confirmed that all three module types had high performance under simple plane displacement condition, whereas individual attachment types had better performance under complex 3D displacement condition. However, it’s important to note that the triangular stacking type and band type, with their small spacing between FBGs, have been developed to overcome the limited attachment conditions of the individual attachment type and to streamline the manufacturing process of the FBG bending sensors. Therefore, it is possible to select the FBG bending sensor according to the installation conditions of the structure to be applied and the required sensor performance by comprehensively considering the performance verification results of this study and the characteristics of the module types.

Funder

National Research Foundation of Korea

Publisher

IOP Publishing

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