Author:
Fan J.Q.,Hou T.H.,Zhao Q.,Zhang F.,Li K.,Fang J.,Hao J.H.,Dong Z.W.
Abstract
Abstract
FinFET is a new mainstream semiconductor device that is
widely used in space applications. This paper studies the effects of
radiation damage typically encountered in space applications by
simulating the effects of total ionizing dose (TID) from 0 to
1 Mrad on a 15 nm n-type bulk FinFET. In particular we have
simulated the effects of radiation damage on the transfer
characteristic curve, threshold voltage and subthreshold swing of
the FinFET. We have also varied some device process parameters such
as gate length, fin width and fin height in order to assess their
impact on the device susceptibility to radiation damage and our
results show that the device structure with longer gate length,
wider fin width and taller fin height have better performance. In
addition, the higher channel doping concentration, the use of
SiO2 in the gate, and the low device operating temperature can
also effectively reduce the TID effects.
Subject
Mathematical Physics,Instrumentation