Tribological analysis on powder slurry in chemical mechanical polishing
Author:
Publisher
IOP Publishing
Subject
Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://stacks.iop.org/0022-3727/35/i=13/a=322/pdf
Reference11 articles.
1. Chemical processes in glass polishing
2. Tribology Analysis of Chemical‐Mechanical Polishing
3. Wear phenomena in chemical mechanical polishing
4. Analysis of flow between a wafer and pad during CMP processes
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1. Investigation of Shear and Thermal Characteristics of Polishing Interface in Soft Pad Polishing Process;Applied Mechanics and Materials;2011-05
2. Synchronous, In Situ Measurements in Chemical Mechanical Planarization;Journal of The Electrochemical Society;2009
3. An improved model considering elastic—plastic contact and partial hydrodynamic lubrication for chemical mechanical polishing;Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology;2008-06-01
4. On a Particle-Augmented Mixed Lubrication Approach to Predicting CMP;MRS Proceedings;2007
5. The Characteristic of Abrasive Particle in Chemical – Mechanical Polishing;Materials Science Forum;2006-01
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