The reduction of the threshold fluence at laser-induced backside wet etching due to a liquid-mediated photochemical mechanism
Author:
Publisher
IOP Publishing
Subject
Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://stacks.iop.org/0022-3727/40/i=10/a=008/pdf
Reference33 articles.
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1. Study on ablation threshold of fused silica by liquid-assisted femtosecond laser processing;Applied Optics;2019-11-13
2. Study on ablation threshold of fused silica glass by femtosecond laser induced backside wet etching;Tenth International Conference on Information Optics and Photonics;2018-11-15
3. Crack-free micromachining on glass substrates by visible LIBWE using liquid metallic absorbers;Applied Surface Science;2010-10
4. Microstructuring of fused silica by laser-induced backside wet etching using picosecond laser pulses;Applied Surface Science;2010-09
5. Hybrid Laser Processing of Transparent Materials;Laser Precision Microfabrication;2010
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