Subject
Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Cited by
14 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Mechanics of direct bonding: Splitting forces;Sensors and Actuators A: Physical;2020-03
2. Strain energy due to splitting forces as a basis for bonding criterion in wafer bonding;Sensors and Actuators A: Physical;2015-10
3. Introduction to Microsystem Design;RWTHedition;2015
4. Introduction;Introduction to Microsystem Design;2011
5. Thin Films;Introduction to Microsystem Design;2011