Epitaxy and oblique face development in nickel electrodeposits on a copper cube face, in relation to rate of deposition, deposit thickness, degree of stirring and bath temperature-Reference-Cited by-同舟云学术

Epitaxy and oblique face development in nickel electrodeposits on a copper cube face, in relation to rate of deposition, deposit thickness, degree of stirring and bath temperature

Published:1971-08-01 Issue:8 Volume:4 Page:1167-1175
ISSN:0022-3727
Container-title:Journal of Physics D: Applied Physics
language:
Short-container-title:J. Phys. D: Appl. Phys.

Author:

Verma S K,Wilman H

Publisher

IOP Publishing

Subject

Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://stacks.iop.org/0022-3727/4/i=8/a=317/pdf

Reference25 articles.

1. Diffusion and convection at electrodes

2. Effect of Crystal Plane on the Mechanism and the Kinetics of Copper Electrocrystallization

3. Crystal growth and orientations in vacuum-condensed silver films and their systematic dependance on the residual air pressure, film thickness, rate of deposition and substrate temperature

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