Author:
Szymański Michał,Szerling Anna,Kosiel Kamil,Płuska Mariusz
Subject
Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Cited by
3 articles.
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2. In-situ thin film copper–copper thermocompression bonding for quantum cascade lasers;Journal of Materials Science: Materials in Electronics;2021-05-15
3. Crucial Aspects of the Device Processing of Quantum Cascade Lasers;Terahertz (THz), Mid Infrared (MIR) and Near Infrared (NIR) Technologies for Protection of Critical Infrastructures Against Explosives and CBRN;2021