A practical approach to reactive ion etching
Author:
Publisher
IOP Publishing
Subject
Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://stacks.iop.org/0022-3727/47/i=23/a=233501/pdf
Reference43 articles.
1. Principles of Plasma Discharges and Materials Processing
2. The Loading Effect in Plasma Etching
3. Anisotropic Reactive Ion Etching of Silicon Using SF 6 / O 2 / CHF 3 Gas Mixtures
4. Heat transfer between wafer and electrode in a high density plasma etcher
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