Stretching-induced interconnect delamination in stretchable electronic circuits-Reference-Cited by-同舟云学术

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Stretching-induced interconnect delamination in stretchable electronic circuits

Published:2010-12-22 Issue:3 Volume:44 Page:034008
ISSN:0022-3727
Container-title:Journal of Physics D: Applied Physics
language:
Short-container-title:J. Phys. D: Appl. Phys.

Author:

van der Sluis O,Hsu Y Y,Timmermans P H M,Gonzalez M,Hoefnagels J P M

Publisher

IOP Publishing

Subject

Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference35 articles.

1. Compliant thin film patterns of stiff materials as platforms for stretchable electronics

2. A Stretchable Form of Single-Crystal Silicon for High-Performance Electronics on Rubber Substrates

3. Buckling of a stiff thin film on a compliant substrate in large deformation

4. Design of metal interconnects for stretchable electronic circuits

5. Materials and Mechanics for Stretchable Electronics

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3. Elastic-plastic buckling of gold thin films into straight-sided blisters;Surface and Coatings Technology;2024-04

4. Experimental and numerical investigation on reliability of encapsulated sine wave interconnect for stretchable substrates;Microelectronics Reliability;2024-04

5. Influence of Elasto-Plastic Behaviour of Thin Films on Circular Buckling Structures;2024

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