On the Oxidative Degradation of Nadic Endcapped Polyimides: I. Effect of Thermocycling on Weight Loss and Crack Formation-Reference-Cited by-同舟云学术

On the Oxidative Degradation of Nadic Endcapped Polyimides: I. Effect of Thermocycling on Weight Loss and Crack Formation

Published:1996-09 Issue:3 Volume:8 Page:363-379
ISSN:0954-0083
Container-title:High Performance Polymers
language:en
Short-container-title:High Performance Polymers

Author:

Meador Mary Ann B,Lowell Carl E¹,Cavano Paul J²,Herrera-Fierro Pilar³

Affiliation:

1. NASA Lewis Research Center, Cleveland OH, USA

2. Case Western Reserve University, Cleveland, OH, USA

3. Ohio Aerospace Institute, Cleveland, OH, USA

Abstract

The effects of thermocycle frequency, aging temperature and post-cure conditions on weight loss, microhardness and crack formation of PMR-15 neat resins were investigated. Crack formation was monitored by metallography. The molecular level changes, occurring under the same conditions, were monitored by microscopic FT-IR in reflectance mode on the same samples. FT-IR analysis was carried out in zones 100 μm in diameter, allowing examination of different regions of the aged samples. It was found that weight loss, crack formation and microhardness were highly dependent on aging time and temperature, but not thermocycling frequency. Molecular level changes were also highly correlated to time and temperature of aging. Both the physical effects of aging and the chemical effects were isolated to a thin surface layer. No changes whatsoever to the interiors of the samples were evident by FT-IR, microhardness or microscopy.

Publisher

SAGE Publications

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

http://journals.sagepub.com/doi/pdf/10.1088/0954-0083/8/3/003

Reference15 articles.

1. [1] Meador M A, Cavano P J and Malarik D C 1990 Proc. 6th Ann. ASM/ESD Advanced Composites Conf. pp 529–539

2. Thermally stable polyimides from solutions of monomeric reactants

3. [4] Young P R and Chang A C 1988 Proc. 33rd Int. SAMPE Symp. pp 538–550

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