On coating adhesion during impulse plasma deposition-Reference-Cited by-同舟云学术

On coating adhesion during impulse plasma deposition

Published:2014-05-01 Issue: Volume:T161 Page:014063
ISSN:0031-8949
Container-title:Physica Scripta
language:
Short-container-title:Phys. Scr.

Author:

Nowakowska-Langier Katarzyna,Zdunek Krzysztof,Chodun Rafal,Okrasa Sebastian,Kwiatkowski Roch,Malinowski Karol,Składnik-Sadowska Elzbieta,Sadowski Marek J

Publisher

IOP Publishing

Subject

Condensed Matter Physics,Mathematical Physics,Atomic and Molecular Physics, and Optics

Link

http://stacks.iop.org/1402-4896/2014/i=T161/a=014063/pdf

Reference21 articles.

1. Concept, techniques, deposition mechanism of impulse plasma deposition — A short review

2. Peculiarities of thin film deposition by means of reactive impulse plasma assisted chemical vapor deposition (RIPACVD) method

3. Spectroscopic study of a pulse plasma used for production and deposition of TiN films

4. Spatially resolved spectroscopy of an impulse plasma for thin film deposition

5. Structure of Fe–Cu alloy layers deposited by IPD method with different frequencies of plasma impulse generation

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