A heterodyne method for the thermal observation of the electrical behavior of high-frequency integrated circuits-Reference-Cited by-同舟云学术

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A heterodyne method for the thermal observation of the electrical behavior of high-frequency integrated circuits

Published:2008-09-22 Issue:11 Volume:19 Page:115704
ISSN:0957-0233
Container-title:Measurement Science and Technology
language:
Short-container-title:Meas. Sci. Technol.

Author:

Altet J,Aldrete-Vidrio E,Mateo D,Perpiñà X,Jordà X,Vellvehi M,Millán J,Salhi A,Grauby S,Claeys W,Dilhaire S

Publisher

IOP Publishing

Subject

Applied Mathematics,Instrumentation,Engineering (miscellaneous)

Reference26 articles.

1. IC failure analysis: techniques and tools for quality reliability improvement

2. Extraction and modeling of self-heating and mutual thermal coupling impedance of bipolar transistors

3. BiCMOS thermal sensor circuit for built-in test purposes

4. Temperature variation mapping of a microelectromechanical system by thermoreflectance imaging

5. Thermoreflectance based thermal microscope

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3. On the Use of Built-In Temperature Sensors to Monitor Aging in RF Circuits;2019 XXXIV Conference on Design of Circuits and Integrated Systems (DCIS);2019-11

4. Temperature Sensors to Measure the Central Frequency and 3 dB Bandwidth in mmW Power Amplifiers;IEEE Microwave and Wireless Components Letters;2014-04

5. Physically based analysis of electrical frequency response of passive microelectronic circuits by heterodyne lock-in thermal means;Journal of Physics D: Applied Physics;2013-10-17

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