Development of a torsion pendulum and its application to measuring the dynamic modulus of adhesives from pre-gelation to the cured state
Author:
Publisher
IOP Publishing
Subject
Applied Mathematics,Instrumentation,Engineering (miscellaneous)
Link
http://stacks.iop.org/0957-0233/25/i=5/a=055603/pdf
Reference19 articles.
1. Development of a dilatometer and measurement of the shrinkage behaviour of adhesives during cure
2. Mechanical relaxation studies of the cure of epoxy resins: 1. Measurement of cure
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