A novel technique for the measurement of stress in thin metallic films
Author:
Publisher
IOP Publishing
Subject
Applied Mathematics,Instrumentation,Engineering (miscellaneous)
Link
http://stacks.iop.org/0957-0233/7/i=6/a=013/pdf
Reference17 articles.
1. A technique for the determination of stress in thin films
2. Principles and Applications of Wafer Curvature Techniques for Stress Measurements in Thin Films
3. Thermal stresses and cracking resistance of dielectric films (SiN, Si3N4, and SiO2) on Si substrates
4. Optical properties and stress of ion-assisted aluminum nitride thin films
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