Wave propagation as a marker of structural and topographic properties of human skin
Author:
Publisher
IOP Publishing
Subject
Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation
Link
http://iopscience.iop.org/article/10.1088/2051-672X/aabfb2/pdf
Reference14 articles.
1. Contribution of human skin topography to the characterization of dynamic skin tension during senescence: morpho-mechanical approach
2. On the anatomy and physiology of the skin
3. Dynamic optical coherence tomography measurements of elastic wave propagation in tissue-mimicking phantoms and mouse corneain vivo
4. Comparison of the surface wave method and the indentation method for measuring the elasticity of gelatin phantoms of different concentrations
5. Quantitative elastography of skin and skin lesion using phase-sensitive OCT (PhS-OCT) and surface wave method
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Contactless mechanical stimulation of the skin using shear waves;Journal of the Mechanical Behavior of Biomedical Materials;2024-08
2. Impact of Indenter Size and Microrelief Anisotropy on the Tribological Behavior of Human Skin;Journal of Biomechanical Engineering;2023-07-14
3. A non-invasive computational method to determine the directionality of skin tension lines;Surface Topography: Metrology and Properties;2023-07-11
4. Surface wave analysis of the skin for penetrating and non-penetrating projectile impact in porcine legs;Forensic Science, Medicine and Pathology;2022-09-14
5. STMP at 10: shaping surface metrology, measurement and phenomena for a decade;Surface Topography: Metrology and Properties;2022-04-29
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3