Surface quality and morphology of NiTiCuZr shape memory alloy machined using thermal-energy processes: an examination of comparative topography

Author:

Balasubramaniyan CORCID,Santosh SORCID,Rajkumar KORCID

Abstract

Abstract Adding alloying elements like copper (Cu) and zirconium (Zr) to binary NiTi shape memory alloys (NiTiCuZr SMA) raises the martensitic transition temperatures and functional fatigue properties while maintaining high corrosion and wear resistance. Therefore, it is essential to make high-precision SMA components with less damage to be machined into various complex shapes, sizes, and surface topographies to meet the needs of several engineering applications. In this research work, advanced machining processes like wire electrical discharge machining (WEDM) and fiber laser machining were employed to machine NiTiCuZr SMA and study their processing parameters’ effects on the surface roughness, topography changes, and surface hardness. 3D surface topography and surface roughness on the machined surfaces were evaluated through contact and non-contact measurement techniques. The differential scanning calorimetry (DSC) test was conducted on the NiTiCuZr SMA before and after machining to confirm changes in the shape memory properties. When both processes were used at high energy levels, the formation of the resolidified layer and surface defects were more pronounced, increasing surface roughness. DSC curves for heating and cooling profiles show similar transformation temperatures for WEDM and laser machined NiTiCuZr SMA. On comparing two different machining processes, the WEDM process resulted in the Ra (μm) being 28.2% lower, the surface topography was smooth, and the microhardness was 11.9% lower than the samples machined using laser machining. This shows that machining of NiTiCuZr SMA using WEDM gives a better surface finish, reaching a fair decision that WEDM is a better alternative to laser machining.

Publisher

IOP Publishing

Subject

Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation

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