Theoretical study of dissociative recombination and vibrational excitation of the ${\mathrm{BF}}_{2}^{+}$ ion by an electron impact
Author:
Funder
USPC
National Science Foundation
La Région Haute-Normandie
Labex-EMC3
Publisher
IOP Publishing
Subject
Condensed Matter Physics
Link
http://stacks.iop.org/0963-0252/27/i=11/a=115007/pdf
Reference19 articles.
1. Preparation of Boron Carbide from BF3 and BCl3 in Hydrogen Plasma of Arc RF Discharge
2. Low-Energy Ion-Assisted Deposition of Boron Nitride Films in Surface-Wave Plasma
3. Plasma Implantation Technology for Upcoming Ultra Shallow and Highly Doped Fully Depleted Silicon On Insulator Transistors
4. Plasma immersion ion implantation for sub-22 nm node devices: FD-SOI and Tri-Gate
5. Low-cost plasma immersion ion implantation doping for Interdigitated back passivated contact (IBPC) solar cells
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Dissociative recombination of N$$_2$$$$\hbox {H}^+$$: a revisited study;The European Physical Journal Special Topics;2023-07-31
2. Population of ground and lowest excited states of sulfur via the dissociative recombination of SH+ in the diffuse interstellar medium;Monthly Notices of the Royal Astronomical Society;2023-04-12
3. Study of bound and resonant states of NS molecule in the R-matrix approach;Journal of Physics B: Atomic, Molecular and Optical Physics;2022-11-16
4. Cross sections for vibrational excitation and dissociative recombination of the CF3+ ion in collisions with low-energy electrons;Plasma Sources Science and Technology;2022-04-01
5. Cross Sections and Rate Coefficients for Vibrational Excitation of H2O by Electron Impact;Atoms;2021-09-06
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3