Surface acoustic wave pressure sensor on ScAlN/3C-SiC/Si layer structure incorporating biomimetic microcantilever: modelling and performance enhancement
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Published:2020-12-09
Issue:1
Volume:30
Page:015021
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ISSN:0964-1726
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Container-title:Smart Materials and Structures
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language:
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Short-container-title:Smart Mater. Struct.
Author:
Zhang QiaozhenORCID,
Zhao Xiangyong,
Wang Feifei,
Luo Yang,
Mao Hongwei,
Han Tao
Abstract
Abstract
This paper presents a bio-inspired cantilever-type SAW pressure sensor based on Scandium-doped AlN (ScAlN)/3CSiC/Si layer structure. The proposed biomimetic microcantilever is configured with stress concentration region (SCR) comprising of a series of narrow slits. For a given depth, by properly setting the number and the width of those slits for a given depth, homogeneous stress/strain distribution in vicinity of SCR are achieved. Furthermore, multi-physics finite element modeling for evaluating the pressure coefficient of frequency (PCF) of a one-port SAW resonant sensor is performed and validated. Then the PCF for the proposed SAW pressure sensor with the optimized biomimetic microcantilever is analyzed. The dependence of ScAlN thin film thickness h
ScAlN and scandium-doped concentration r of Sc
r
Al1-r
N thin film on PCF for different SAW modes including Rayleigh mode and Sezawa mode are calculated. The investigation results show that the maximum PCF of −111 ppm bar−1 can be achieved for Rayleigh mode, which is 2.4 times larger than that of the previously reported ZnO/Si structure. In addition, its PCF has weak dependence on h
ScAlN, which are quite favorable for manufacturing pressure sensors with good reproducibility. The conceived bio-inspired cantilever-type SAW devices based on ScAlN/3 CSiC/Si structure will open the door to develop pressure sensors with a stable and reliable performance and enhanced sensitivity.
Funder
National Natural Science Youth Foundation of China
Science and Technology Commission of Shanghai Municipality
National Natural Science Foundation of China
Subject
Electrical and Electronic Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics,Civil and Structural Engineering,Signal Processing
Cited by
2 articles.
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