Resistive heating of a shape memory composite: analytical, numerical and experimental study

Author:

Pereira Sánchez ClaraORCID,Houbben Maxime,Fagnard Jean-François,Laurent Philippe,Jérôme Christine,Noels Ludovic,Vanderbemden Philippe

Abstract

Abstract This work investigates in detail the Joule resistive heating phenomenon of electroactive shape memory composites (SMC) when an electric current is injected at constant power. The SMC is a covalent poly(ϵ-caprolactone) network filled with 3 wt% of multiwall carbon nanotubes. The resistive heating of the SMC is studied by means of surface temperature measurements, analytical formulas and a coupled 3D thermo-electric numerical model. Analytical expressions are derived for the 2D temperature distribution within a parallelepipedic SMC, either with constant or linearly-dependent electrical resistivity. These analytical expressions can be used to investigate the influence of geometrical and material parameters in the steady-state temperature and its distribution across the sample. The results also allow one to identify the parameters that are crucial for predicting the temperature rise due to resistive heating: the temperature dependence of the resistivity has little effect on the steady-state temperature, whereas the thermal conductivity plays a significant role. The time-dependent temperature is shown to be related to the particular temperature dependence of heat capacity. Furthermore, the presence of external objects (clamps or grips) used during the shape memory cycle must be taken into consideration for a certain temperature to be reached since they result in a lower steady-state temperature and a slower resistive heating phenomenon. With the findings presented in this work, accurate resistive heating can be predicted for a SMC upon the injection of an electric current at constant power.

Funder

Fédération Wallonie-Bruxelles

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics,Civil and Structural Engineering,Signal Processing

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