Lamb wavefield-based monogenic signal processing for quantifying delamination in composite laminates

Author:

Sun HuORCID,Shao Weihan,Song Jiannan,Yang Xiaofeng,Wang YishouORCID,Qing XinlinORCID

Abstract

Abstract Delamination is one of the common damages affecting the safety of composite structures. In this paper, a Lamb wavefield-based monogenic signal processing algorithm is proposed to quantify the delamination parameters in composite laminates, including location, size, shape, and depth. A quality-guided fast phase unwrapping algorithm is developed to solve the problem of phase wrapping after Riesz transform-based monogenic signal processing. Then, space distribution of the phase of Lamb wavefield can be extracted for calculating wavenumber distribution, which is related to the structural thickness or delamination depth and can be used for delamination imaging. Simulated Lamb wavefield signals calculated by finite element simulation are employed to evaluate the parameters of delamination in composite laminates. Compared with other traditional methods, the damage identification algorithm based on Riesz transform has excellent identification effect and shorter calculation time. The results show that the algorithm can be used not only for single delamination recognition but also for multi-delamination recognition with good accuracy. In particular, the interaction between incident waves along different ply directions and delamination is explored, and its influence on delamination quantification is studied, whose results are worthy of attention in engineering application. Finally, a completely non-contact laser ultrasonic system is established to obtain the Lamb wavefield with delamination. Experiments show that the algorithm can accurately quantify the location, size, shape, and depth of delamination.

Funder

Chinese Aeronautical Foundation

Natural Science Foundation of China

China Postdoctoral Science Foundation

Innovation Foundation for Young Scholar of Xiamen

Fundamental Research Funds for the Central Universities

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics,Civil and Structural Engineering,Signal Processing

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