Author:
Su Wei,Luo Wenhao,Li Junkui,Liu Renhuai
Abstract
Abstract
In this paper, the thermal-mechanical coupling finite element analysis of MLCC wave soldering with heat conduction and heat convection is calculated, and the steady-state temperature field and transient temperature field as well as the stress distribution of MLCC are obtained. Using the finite element analysis method of indirect thermal-mechanical coupling, the stress analysis is carried out with the temperature field as the boundary condition, and the thermal-structural coupling model is established. By analyzing the thermal stress of MLCC, the weak parts sensitive to thermal stress are determined, which provides a useful reference for solving the reliability problem of MLCC wave soldering.
Reference6 articles.
1. Application research of multi-layer ceramic capacitors and chip tantalum capacitors [D];yuanyuan,2015
2. Thermo - Mechanical Stresses and Mechanical Reliability of Multilayer Ceramic Capacitors (MLCC) [J];Park;Journal of the American Ceramic Society,2007
3. Thermal Shock - Testing and Fracturing of MLCCs Under Manual - Soldering the Conditions [J];Teverovsky;IEEE the Transactions on Device & Materials Reliability
4. Olgierd A Palusinski. Reliability, thermal analysis and optimization design of multi-layer PCB boards [A];Tian,2002
5. Fracture analysis and improvement measures of MLCC in plate power supply [J];lei;Electronic components and materials,2013