Unsteady Coupled Heat Transfer Simulation of Unsteady numerical simulation of slot flow in anti-heating tile

Abstract

Abstract An unsteady coupled heat transfer solver is developed in the study. The coupled solver, solving the partial differential equations for fluid flow and thermal conduction in the solid, is employed to predict the unsteady heat and transfer in the anti-heating tile. The influence of gap depth on the fluid flow and solid thermal conduction is studied. The results show that the flow field distribution between the different gap depths is similar, otherwise reducing the gap depth is conducive to reducing the thermal load in the bottom plate.