Abstract
Abstract
The heat transfer coefficient at the blank-die interface is difficult to determine the values from experiments due to the influence of various factors, such as forming load, coating material, coating thickness, roughness of surfaces and gap formation caused by the deformation of blank and die, etc. In the present paper, the interfacial heat transfer coefficient (IHTC) between the blank and die is identified by using the method of inverse analysis based on measured temperatures. The results show that the method of inverse analysis is a feasible and effective tool for determination of the blank-die IHTC. In addition, it is found that the identified IHTC varies with temperature and load during hot stamping. The characteristics of the IHTC variation have also been discussed.
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献