Investigations on thermal contact resistance between filled polymer composites and solids using micro thermography

Abstract

Abstract This article reports the use of a new measurement technique based on micro thermography for determining the thermal contact resistances (TCRs) between filled polymers and solids. The thermal conductivity of polymers can be significantly increased by using thermally conductive fillers. For numerous applications, not only is a high intrinsic thermal conductivity required but also a good thermal transfer between the filled polymer and an adjacent solid surface. The physical principles of thermal transport when considering this type of contact have not yet been investigated in detail, and only a few experimental results are available. The most common measurement techniques determine a macroscopic resistance and project it onto the contacting surface. However, the heterogeneous microstructure of a filled polymer causes the TCR to be a volumetric phenomenon in the overall boundary region. The utilized IR camera system takes thermal images with a spatial resolution of less than 15 μ m per pixel. The new method resolves the TCRs spatially and gives new insights into the microscale effects on the particle level. In addition to the common zero-gap extrapolation for the extraction of TCRs, we propose another evaluation method that considers all microscale effects of the boundary layers and evaluates TCR as a volumetric phenomenon. For the first systematic study, samples consisting of two aluminum substrates and a filled epoxy polymer were prepared and investigated. We studied the effects of filler size, filler material, filler volume fraction, and surface structure, focusing on monomodally filled polymers with filler amounts between 30 and 60 v % . The obtained results and the uncertainties of the new method are discussed within this paper.