Process development and validation of next generation 3D calibration standards for application in optical microscopy

Abstract

Abstract A scalable wafer-based fabrication process for a new generation of 3D standards enabling the 3D calibration of optical microscopes is presented and validated. The 3D standards are based on step pyramids with several layers in the µm range and a system of cylindrical knops distributed across the layers as marks for coordinate based calibration. This enables calibration for the three coordinate axes and the orthogonality error between them in a single measurement step. The requirements necessary for such a calibration, as optical non-transparency, reproducible flatness of the pyramid step heights and the lowest possible deviations of the lateral marks coordinates, are met by optimizing the manufacturing process: The deviation of the height steps distributed over the wafer is ±3.6 nm and is primarily caused by the layer deposition processes. The lateral manufacturing accuracy was determined using calibrated scanning electron microscope (SEM) and show a mean deviation of 20 or 60 nm, depending on the lateral size of the structures. The electron beam lithography process and the level of inaccuracy of the SEM standard have an influence on the lateral scaling accuracy. Based on the tactilely generated height values and the coordinates of the mark determined by a calibrated SEM, an example calibration of a confocal laser scanning microscope was successfully performed and showed good conformity to conventional calibration techniques.