Fabrication of a microstrip patch antenna integrated in low-resistance silicon wafer using a BCB dielectric
Author:
Publisher
IOP Publishing
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://stacks.iop.org/1674-4926/34/i=10/a=104008/pdf
Reference10 articles.
1. Wafer-Level Packaging Technology for High-<tex>$Q$</tex>On-Chip Inductors and Transmission Lines
2. Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate
3. A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications
4. A technique for interconnecting millimeter wave integrated circuits using BCB and bump bonds
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