Modeling of the interface formation during CuO deposition on Al(111) substrate: linking material design and elaboration process parameters through multi-levels approach-Reference-Cited by-同舟云学术

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Modeling of the interface formation during CuO deposition on Al(111) substrate: linking material design and elaboration process parameters through multi-levels approach

Published:2017-08-01 Issue:6 Volume:25 Page:064005
ISSN:0965-0393
Container-title:Modelling and Simulation in Materials Science and Engineering
language:
Short-container-title:Modelling Simul. Mater. Sci. Eng.

Author:

Guiltat M,Salles N,Brut M,Landa G,Richard N,Vizzini S,Hémeryck A^ORCID

Publisher

IOP Publishing

Subject

Computer Science Applications,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modelling and Simulation

Link

http://stacks.iop.org/0965-0393/25/i=6/a=064005/pdf

Reference44 articles.

1. Thin films and interfaces in microelectronics: composition and chemistry as function of depth

2. Towards systems materials engineering

3. Effect of nanostructures on the exothermic reaction and ignition of Al/CuOx based energetic materials

4. Experimental flame speed in multi-layered nano-energetic materials

5. Nanocrystalline Materials

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Tunable morphology and band gap alteration of CuO-ZnO nanostructures based photocathode for solar photoelectrochemical cells;Materials Research Express;2020-12-01

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