Temperature and grain size dependences of mechanical properties of nanocrystalline copper by molecular dynamics simulation-Reference-Cited by-同舟云学术

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Temperature and grain size dependences of mechanical properties of nanocrystalline copper by molecular dynamics simulation

Published:2019-06-18 Issue:6 Volume:27 Page:065012
ISSN:0965-0393
Container-title:Modelling and Simulation in Materials Science and Engineering
language:
Short-container-title:Modelling Simul. Mater. Sci. Eng.

Author:

Chen Pei^ORCID,Zhang Zhiwei^ORCID,Liu Chenshuo,An Tong^ORCID,Yu Huiping,Qin Fei

Funder

National Science and Technology Major Project

National Natural Science Foundation of China

Publisher

IOP Publishing

Subject

Computer Science Applications,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modelling and Simulation

Link

https://iopscience.iop.org/article/10.1088/1361-651X/ab2621/pdf

Reference43 articles.

1. Mechanical properties of nanocrystalline materials

2. Deformation of nanocrystalline materials by molecular-dynamics simulation: relationship to experiments?

3. What is behind the inverse Hall–Petch effect in nanocrystalline materials?

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