On the primary spacing and microsegregation of cellular dendrites in laser deposited Ni–Nb alloys
Author:
Publisher
IOP Publishing
Subject
Computer Science Applications,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modelling and Simulation
Link
http://stacks.iop.org/0965-0393/25/i=6/a=065002/pdf
Reference69 articles.
1. Fabrication of Metal and Alloy Components by Additive Manufacturing: Examples of 3D Materials Science
2. Rapid solidification processing and microstructure formation
3. On the Dendritic Growth and Microsegregation in Ni-Base Superalloys Ιn718, In625 and In939
4. Reduction of micro-cracking in nickel superalloys processed by Selective Laser Melting: A fundamental alloy design approach
Cited by 112 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Microstructure forming mechanism of inconel 625 alloy fabricated by laser/ultra-high (UHF) induction hybrid deposition method;Journal of Materials Research and Technology;2024-09
2. Research on gas pore formation and inhibition mechanism of high nitrogen steel during laser direct metal deposition;Optics & Laser Technology;2024-08
3. Bridging molecular dynamics and additive manufacturing: A study of Al-12 at% Si alloy solidification dynamics;Materials Today Communications;2024-08
4. Microstructural and mechanistic insights into the Tension–Compression asymmetry of rapidly solidified Fe–Cr alloys: A phase field and strain gradient plasticity study;Journal of the Mechanics and Physics of Solids;2024-08
5. Effect of adaptive control of cooling rate on microstructure and mechanical properties of laser additively manufactured Inconel 718 thin walls;Materials Characterization;2024-07
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3