Eliminating mechanical perturbations in scanning probe microscopy
Author:
Publisher
IOP Publishing
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,General Chemistry,Bioengineering
Link
http://stacks.iop.org/0957-4484/13/i=5/a=324/pdf
Reference7 articles.
1. Mechanical lapping, handling and transfer of ultra-thin wafers
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