Plastic deformation kinetics in nanocrystalline FCC metals based on the pile-up of dislocations
Author:
Publisher
IOP Publishing
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,General Chemistry,Bioengineering
Link
http://stacks.iop.org/0957-4484/18/i=32/a=325701/pdf
Reference55 articles.
1. Grain size dependence of the plastic deformation kinetics in Cu
2. Grain-size dependence of the flow stress of Cu from millimeters to nanometers
3. Effect of grain size from millimeters to nanometers on the flow stress and deformation kinetics of Ag
4. Effect of grain size from mm to nm on the flow stress and plastic deformation kinetics of Au at low homologous temperatures
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