Encapsulate-and-peel: fabricating carbon nanotube CMOS integrated circuits in a flexible ultra-thin plastic film
Author:
Publisher
IOP Publishing
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,General Chemistry,Bioengineering
Link
http://stacks.iop.org/0957-4484/25/i=6/a=065301/pdf
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1. High-Performance Flexible Thin-Film Transistors Exfoliated from Bulk Wafer
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5. High-Resolution Inkjet Printing of All-Polymer Transistor Circuits
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