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Encapsulation layer design and scalability in encapsulated vertical 3D RRAM

  • Published:2016-04-04 Issue:20 Volume:27 Page:205202
  • ISSN:0957-4484
  • Container-title:Nanotechnology
  • language:
  • Short-container-title:Nanotechnology

Author:

Yu Muxi,Fang Yichen,Wang Zongwei,Chen Gong,Pan Yue,Yang Xue,Yin Minghui,Yang Yuchao,Li Ming,Cai Yimao,Huang Ru

Funder

National High Technology Research and Development Program of China

Open Fund of IPOC (BUPT)

National Natural Science Foundation of China

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,General Chemistry,Bioengineering

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