Study on the interfacial bonding mechanism of Al/Mg gradient material

Abstract

Abstract Ti/Al/Mg impedance-graded material sheet is an alternative to the homogeneous single-layer sheets, which has been presented to improve shielding performance through the high efficient absorption and dissipation of fragment kinetic energy. Nevertheless, one limitation of the Ti/Al/Mg gradient material is associated with the weak Al/Mg interface. The purpose of this study is to investigation the interfacial bonding mechanism of Al/Mg gradient material interface. Microstructure characteristics at the Al/Mg interface have been investigated. It shows that an isolated island structure preferentially generates at the crystal defect as a consequence of interdiffusion, which is composed of Al3Mg2 and Al12Mg17. Then such intermetallic compounds (IMCs) grow to continuous layers with distinct convex. Finally, the interface is fully transformed into flat. A theoretical analysis and calculation have been carried out to explain the thermodynamically feasibility of IMCs. The evolution mechanism of voids at the interface is also discussed. Fractographic analysis performed on selected specimens shows typical brittle cleavage fracture characteristics, and detailed analyses reveal that the fracture failure is associated with brittle IMCs.