Multi-layered micro-patterns co-printed with Ag@CuO nano-ink for flexible devices

Abstract

Abstract Silver (Ag) nano-ink is widely used to fabricate the micro-patterns of flexible electronic devices owing to its excellent conductivity and stability. However, the cost of micro-patterns prepared with silver nano-ink is high. Here, multi-layered, multi-inked (silver@copper oxide) micro-patterns were co-printed layer by layer using an in-house silver nano-ink and commercial copper oxide (CuO) nano-ink. The prepared micro-patterns were solidified by laser sintering. Among the co-printed micro-patterns, the micro-pattern with a top layer of copper (1CuO@2Ag) had the lowest resistance, which was 13.1 Ω cm–1. Additionally, 1CuO@2Ag had the smoothest topography and lowest porosity, which was attributed to effective sintering at the optimal laser power (3 W) for all co-printed micropatterns owing to the high absorptivity and low reflectivity of copper. Moreover, after 500, 1000, and 1500 cycles of fatigue testing, the resistance of 1CuO@2Ag increased by 1.5%, 8.4%, and 13.7%, respectively, indicating good reliability. The proposed method lays the foundation for further studies on Ag@CuO composites for micro-pattern preparation.