Study on the creep properties of Cu-Se-(Te) alloys
Author:
Funder
Sichuan Science and Technology Program, China
Publisher
IOP Publishing
Subject
Metals and Alloys,Polymers and Plastics,Surfaces, Coatings and Films,Biomaterials,Electronic, Optical and Magnetic Materials
Link
http://iopscience.iop.org/article/10.1088/2053-1591/ab466c/pdf
Reference24 articles.
1. Impression creep behavior of a Cu–6Ni–2Mn–2Sn–2Al alloy
2. Dislocation interaction with Ω phase in crept Al–Cu–Mg–Ag alloys
3. Damage propagation mechanism in low-cycle creep fatigue of Cu–Cr–Zr alloy
4. Characterization of the hot-working behavior of a Cu-Ni-Si alloy
5. Experimental investigations, input-output modeling and optimization for electron beam welding of Cu-Cr-Zr alloy plates
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