Abstract
Abstract
In this paper, the hydrogen diffusion behavior and hydrogen induced delayed fracture (HIDF) of Q-P980 (Q-P: Quenching and Partitioning) and MS980 (MS: Martensitic steel) steels were investigated using hydrogen penetration, slow strain rate tensile (SSRT) tests, thermal desorption spectroscopy (TDS) tests, fracture analysis, and microstructural examination in this paper. The austenite in Q-P980 is massive retained-austenite (RA) with low stability. The TRIP (Transformation Induced Plasticity) effect will occur in the process of strain and change into high carbon martensite. HIDF is caused by a substantial amount of surplus hydrogen being enriched at the border and flaws. The fracture has a broad cleavage surface and is a typical quasi-cleavage fracture. MS980 has been sufficiently tempered, resulting in a substantial quantity of distributed spherical cementite (150nm) precipitating around the lath martensite. This size and form of cementite may successfully trap hydrogen while maintaining the material’s mechanical characteristics. And tempering can effectively reduce the local stress level of steel, so MS980 has a very low HE susceptibility. HIDF is related to local stress and hydrogen accumulation. We suppose that Z is a constant and Z
C is a critical value which associated to σ and C
H (the local stress and local hydrogen concentration), rising as σ and C
H rises. The atomic bonds at the crack tip, lattice position and the phase interface will fracture when Z
C reaches a particular value Z. Tempering to minimize local stress and carbide precipitation to capture hydrogen are two strategies for reducing hydrogen embrittlement (HE) susceptibility, particularly for dislocation strengthened steel. Microalloying elements can generate precipitates that function as hydrogen traps and obstruct the HELP (Hydrogen Enhanced Localized Plasticity) process, lowering local stress and hydrogen accumulation.
Funder
National Natural Science Foundation of China
Subject
Metals and Alloys,Polymers and Plastics,Surfaces, Coatings and Films,Biomaterials,Electronic, Optical and Magnetic Materials