Dynamic recrystallization analysis of reduction pretreatment process by multi-phase field method

Author:

Liu Hongqiang,Ning Zhen,Yu WeiORCID,Cheng ZhichengORCID,Wang Xindong,Cai Qingwu

Abstract

Abstract The reduction pretreatment (RP) process is an effective method to improve billet quality, and the deformation recrystallization plays an important role in the process. Exploring the RP process parameters, a dynamic recrystallization model of GCr15 steel was established by the phase-field method and physical simulation. The recrystallization kinetics and flow stress curves during hot compression were simulated by using this mode. The effects of deformation parameters and initial grain size on the dynamic recrystallization were investigated. Moreover, by using the results obtained by Finite element method (FEM), dynamic recrystallization during the RP process was investigated though this model. It was found that increasing the deformation temperature, deformation rate and decreasing the initial grain size can promote the dynamic recrystallization kinetics. Large Zener-Hollomon parameters can enhance recrystallized grain refinement, while the recrystallized grain size was not affected by the initial grain size. During the RP process, when the reduction is insufficient (10%), partial recrystallization occurs in the billet. With the increase of reduction from 10% to 16%, the area of complete recrystallization increases gradually. When the reduction is the same, the recrystallization in the billet center increases with the decrease of casting speed. When the reduction is 10%, partial recrystallization occurs in the billet center at a casting speed of 0.7 m min−1, and fully recrystallization occurs in the billet center with a casting speed of 0.5 m min−1. Thus, when the reduction is difficult to increase further, the recrystallization in the billet center can be improved by decreasing the casting speed.

Publisher

IOP Publishing

Subject

Metals and Alloys,Polymers and Plastics,Surfaces, Coatings and Films,Biomaterials,Electronic, Optical and Magnetic Materials

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