Interfacial reaction and mechanical properties of diffusion bonded titanium/17-4 PH stainless steel dissimilar joint using a silver interlayer

Author:

Feng BoORCID,Deng YongqiangORCID,Feng Xiaowei,Wang Juan,Zheng Kaihong

Abstract

Abstract Diffusion bonding of titanium (Ti) to 17-4 PH high strength stainless steel is challenging owing to the formation of brittle Ti-Fe intermetallic compounds (IMCs) at joint interface. In the current study, it was demonstrated that such detrimental Ti-Fe IMCs can be effectively eradicated by using a silver (Ag) interlayer. The diffusion bonded Ti/Ag/17-4 PH stainless steel is characterized by Ti-Ag solid solution, TiAg, remnant Ag interlayer and Ag-(Fe, Cr, Ni) interdiffusion layer. The interfacial reaction phase TiAg exhibited no detrimental effect on bonding strength. During tensile test, ductile fracture took place in the remaining Ag interlayer of resultant joint. Bonding strength up to ∼420 MPa was obtained over bonding durations in the range of 15 ∼ 25 min. It is thus concluded that using an Ag interlayer is highly appealing in improving bonding strength of diffusion bonded Ti/17-4 PH stainless steel dissimilar joint.

Funder

National Natural Science Foundation of China

Guangdong Province Key Area R&D Program

Guangdong Special Support Program

Open Fund of National Joint Engineering Research Center for abrasion control and molding of metal materials

Guangdong Academy of Science Fund

Publisher

IOP Publishing

Subject

Metals and Alloys,Polymers and Plastics,Surfaces, Coatings and Films,Biomaterials,Electronic, Optical and Magnetic Materials

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Bonding of ceramics to silver‐coated titanium—A combined theoretical and experimental study;Journal of Biomedical Materials Research Part B: Applied Biomaterials;2024-04-27

2. Electrochemical analysis of friction welded 17-4 PH stainless steel components manufactured by selective laser melting;International Journal on Interactive Design and Manufacturing (IJIDeM);2023-12-17

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