Sn-Mg lead-free solder alloy: Effect of solidification thermal parameters on microstructural features and microhardness-Reference-Cited by-同舟云学术

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Sn-Mg lead-free solder alloy: Effect of solidification thermal parameters on microstructural features and microhardness

Published:2019-11-27 Issue:12 Volume:6 Page:126562
ISSN:2053-1591
Container-title:Materials Research Express
language:
Short-container-title:Mater. Res. Express

Author:

da Cruz Clarissa B^ORCID,Lima Thiago S^ORCID,Costa Thiago A^ORCID,Brito Crystopher^ORCID,Garcia Amauri^ORCID,Cheung Noé^ORCID

Funder

Conselho Nacional de Desenvolvimento Científico e Tecnológico

Fundação de Amparo à Pesquisa do Estado de São Paulo

Publisher

IOP Publishing

Subject

Metals and Alloys,Polymers and Plastics,Surfaces, Coatings and Films,Biomaterials,Electronic, Optical and Magnetic Materials

Link

http://iopscience.iop.org/article/10.1088/2053-1591/ab58f9/pdf

Reference51 articles.

1. Development of high strength Sn-Mg solder alloys with reasonable ductility

2. Determination of mechanical, electrical and thermal properties of the Sn―Bi―Zn ternary alloy

3. Thermo-electrical characterization of Sn–Zn alloys

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of cooling rate and aging duration on microstructure of tin-copper solder joint;1ST INTERNATIONAL SEMINAR ON ADVANCES IN METALLURGY AND MATERIALS (i-SENAMM 2019);2020

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